What are the major benefits of C4NP compared to plating technology?
1. C4NP processes solder and UBM in parallel; plating serially. Parallel processing assures optimal bumping yields by isolating solder yield issues which could affect costly silicon wafers. 2. C4NP combines “low end” simplicity with “high end” capabilities. A simple process similar to paste screening fills reusable bump molds, but with pure molten alloy allowing much finer bump sizes and pitches typically achievable only with plating. 3. Plating requires one photo-resist solder mask per wafer. C4NP uses the same bump mold to bump hundreds of wafers, thus lowering costs. 4. Plating uses complex wet chemistries, which are completely avoided with C4NP. UBM’s on wafers may be sputter processed or electro-less plated (Nickel-Gold). 5. Traditional current density limitations for plating processes are not an issue for C4NP. 6. C4NP also provides the fastest possible turn around time for wafer bumping. Whereas plating, solder printing and evaporation require the wafer to produce the solder bum
