What are the major benefits of C4NP compared to evaporation?
1. C4NP combines two additional processing steps required for preformed solder spheres; one being the producing of these precision spheres and two being the positioning of the spheres. Both of these are automatically accomplished by the molds scanning under the solder fill head which deposits precise bump solder volumes into cavities corresponding to the bump locations on the wafer. 2. C4NP avoids handling complexities of preformed solder spheres. At typical bump dimensions of 75 to 100 microns, even static electricity is a major obstacle to positioning individual solder spheres at predetermined locations.
