What are the main qualification tests for using lead-free solder paste?
A good selection process for a lead-free paste is essential to a defect free SMT process. Firstly the board finish and component finishes must be determined and the flux chemistry chosen to adequately solder these finishes. Some pastes do well with tinned surfaces but solder poorly bare copper OSP. The solder paste manufacture will normally do extensive testing such as spread and wetting of its particular solder paste in both air and nitrogen atmospheres. This information should be requested.