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What are the main factors that improve Ultra CSPTM solder joint reliability?

April 26, 2017csptm factors Joint main reliability solder Ultra

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What are the main factors that improve Ultra CSPTM solder joint reliability?

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The main factors are solder ball size (standoff), distance to neutral point (DNP), solder alloy selection, and the board assembly technique. FCI has invested significant research efforts into optimizing the solder ball standoff and analyzing various solder alloys for improved solder joint reliability.