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What are the changes in reference to lead-free assembly in the J-STD-020C, dated July 2004?

April 26, 2017assembly changes dated j-std-020c july 2004 Lead-Free Reference

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What are the changes in reference to lead-free assembly in the J-STD-020C, dated July 2004?

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The IPC/JEDEC J-STD-020C, issued July 2004, entitled Moisture/Reflow Sensitivity Classification for Non-hermetic Solid State Surface Mount Devices details the thermal profiles SMD components must meet to be classified as lead-free process capable. Higher thermal profiles with lead-free in the range of 235-255º C, may require component re-qualification to new moisture sensitivity limits. This needs to be known and adequate measures taken to avoid moisture issues such as popcorning, delamination and cracking issues during lead-free reflow. This document is also useful to procurement, where lead-free components can be referenced to the requirements set in this standard.