What are the catastrophic failure mechanism for LEDs?
The most common cause of failure in LEDs is mechanical overstress. If the temperature of the package reaches its ‘Glass Transition Temperature’ (Tg), then the epoxy expands rapidly, stressing many of the internal components of the LED. Wire bond breakage, wire bond detachment, die attach loss all stem from overheated epoxy or cause a delamination between the chip and the epoxy. Another failure mechanism is ESD for InGaN devices. Our conventional InGaN LEDs and flip-chip InGaN LEDs are classified as ‘Class 1’ and ‘Class 3’ ESD sensitive respectively.
