What are the benefits when mounting or using a thick compressible soft-silicone interface material ?
The material’s thicknesses together with the high thermal conductivities make it possible to thermally link any heat sources to the respective heat sinks even over spacy air gaps. Through the high compressibility a high compliance is reached and electronic parts are embraced cushion-wise thus maximizing the contact area and reducing the overall thermal resistance to a minimum. Because of the high softness and the low mounting pressures needed, sensitive PCB boards, power modules as well as housings are protected from mechanical damage.
