What are the advantages of using theses materials?
We often replace Epoxy potting of electronics. Low Pressure Molding is a faster and more efficient process. With LPM we can “Sky Line” the molding material around your product. This gives us a shorter cycle time and saves raw material at the same time. It also eliminates the housing otherwise needed to contain the potting material. Our Polyamide molding material simply “becomes the housing”. Low injection pressure allows us to gently mold around fragile components. This technology offers a good solution when standard high injection pressure is a problem.
