What are the advantages of thin boundary layer deposition from a process perspective?
Better uniformity results because the ShearPlate agitation decouples the fluid flow and electric field at the wafer surface, providing more range for field uniformity optimization. In fountain cells, the fluid boundary layer thickness varies with radial position on the wafer surface; with ShearPlate agitation, the boundary layer is thin and uniform. The Stratus ensures complete filling of deep photoresist patterns and void-free solder bumps and TSVs.
