What are the advantages of SOLDERED interconnected RFID tags and compression-formed and adhesive bonded tags?
• Soldered tags uses pure copper rather than screen-on silver inks to provide the most consistent conductance and thus higher performance by approximately 10-20% depending on the frequency of operation. • Silver conductive inks while has the advantage of the “additive” technology, but at the cost of conductivity variation, fine-line limitation and less conductive and thus shorter read distance. It is not usable for the 13.56 MHz RFID applications. • Silver conductive ink antenna typically uses conductive adhesive bonding of chip (some uses Z-axis conductive adhesive) in a flip-chip mode. The process is typically higher in cost and slower in processing. It is only useful for 915 and 2450 MHz RFID tags. • Soldering using the patent-pending “chip-jumper” approach is an industrial standard printed wiring board approach that have been proven for the ultimate fast surface mounting assembly with lower cost equipment at extreme high rate of 72,000 units per hour per assembly station. There is
