What are some specific applications in the semiconductor industry that your company addresses with 3D machine vision technology?
[Rajiv Roy, August Technology] Bump Inspection [David Banitt, Nano-Or Technology] There are various applications that the technology of Nano-Or can beneficially used for: • Copper plated patterned and non-patterned wafer (pre-CMP metrology) • Post CMP metrology – Dishing and erosion • Shallow Trench Isolation (STI) • Metallized layers characterization, thickness and roll-off • EPI Layers • Bare Silicon for starches, slips and warp • Back side roughness after thinning • Bumps • Probes’ marks [Bob Michaels, RVSI] One specific application would be to measure the height of each and every bump across an entire flip chip wafer to ensure 100% product quality while also providing valuable data relative to upstream processes. Another application would be to verify the coplanarity of all leads on an entire lot of fully assembled surface mount chips. RVSI provides fully automated, three-dimensional metrology and defect detection to verify the dimensional and cosmetic integrity of wafers as well a
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