What are some methods of destructive package failure analysis?
Package disassembly or removal of a layer in a package can be performed by cross sectioning, decapsulating, parallel polishing or grinding, and peeling. Decapsulating is typically done with the use of acids, such as liquid nitric/sulfuric acid. Parallel polishing or grinding involves the removal of one layer at a time, parallel to the adhesive bond line. Peeling can be done by heating the package and removing individual layers.
