What Are Potting Compounds?
Microelectronic devices for most commercial applications are encased in a plastic packaging material such as Potting compound, a glob top or a molding compound. It is liquid that consist of two parts: a resin and a hardener or accelerator. They are mixed in a defined ratio to uniformity and then de-aired under reduced pressure prior to application. Potting compound is also referred to as encapsulants. There is several type like Epoxy, silicone, polyurethane and thermal potting compound. The other include Acrylic potting compounds are UV and heat hardening materials, Polyester and hot melt potting compounds. The important features: 1. Low viscosity and long pot life at application temperature. 2. Appropriate cure speed at a reasonable cure temperature 3. Good adhesion to and compatibility with all surfaces of substrates. 4. Requires low stress particularly when it’s a ceramic base or substrates board is used. 5. Its resistance to filler settling 6. Good thermal stability 7. Good electri
