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Up to what lamination temperature Doublethin® foil can be used?

April 26, 2017doublethin® foil lamination temperature Used

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Up to what lamination temperature Doublethin® foil can be used?

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Starting from a low ‘carrier bond’ value the maximum lamination temperature is about 220 – 225 °C. Circuit Foil’s leading production technology for ultra-thin copper foils allows the control of the bonding properties between the carrier and the functional ultra-thin copper foil. Based on the lamination temperature this ‘carrier bond’ will be set-up to an optimized range. Therefore the application (substrate, lamination temperature) should be specified in your P.O.