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Some of Freescales Flip Chip BGA packages do not contain lead (Pb) at the terminations (solder balls). Are these packages lead (Pb) free and RoHS compliant?

April 26, 2017BGA chip contain flip freescale lead Packages Pb solder terminations

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Some of Freescales Flip Chip BGA packages do not contain lead (Pb) at the terminations (solder balls). Are these packages lead (Pb) free and RoHS compliant?

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All Flip Chip BGA packages contain lead (Pb) in the first level interconnects (the die bumps). All lead (Pb) contained in this interface has been exempted from EU RoHS by Annex Exemption # 15, “Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit flip chip packages.” Lead could also be contained in solder flux, capacitors, or capacitor-attach solder. Refer to the IPC1752 Product Content Declaration for specific part numbers to determine RoHS compliance.