Should I change the design of my StencilQuik™ stencil if the board I am using has solder mask defined pads instead of non-solder mask defined pads?
Related Questions
- Do I need to mask off the areas surrounding the StencilQuik™ stencil while I am applying the solder paste, and if I do, what is the best material and method for that?
- If the solder mask is damaged or missing in the area of the board where the StencilQuik™ stencil will be applied, do I have to repair the mask underneath the part?
- Do the bond pads need to be cleaned (e.g. from oxide) before solder transfer?