My die has large unpassivated areas. What precautions should I take?
To alert MOSIS to the presence of your unpassivated design, please send an Update request (web form or e-mail template) with a SPECIAL-HANDLING parameter with the following text, plus any additional comments you wish to provide: “UNPASSIVATED DIE. Nothing may contact the wafer top surface. Wafer carriers and shipping containers must contact wafers only at the edges. Use tweezers to handle individual dice only from the sides and bottom. Place all loose dice, including spares, in GEL-PAK’s for shipping and storage.” This UNPASSIVATED DIE special handling is intended for open areas on the die surface where damage can occur if contacted. If glass openings have MEMS structures that will be etched in post processing, or the glass openings are over bonding or probe pads, this unpassivated special handling should not be required. NOTE: Although we and our vendors take special care with wafers known to contain unpassivated active circuit areas, MOSIS cannot guarantee the electrical or mechanica
