Is there an optimal temperature for removing the superstructure from the MTP plate?
The optimal temperature for successfully removing the superstructure from the MTP patterned glass plate is between 31 and 41C. At lower temperatures (20 to 30C), the double-sided adhesive foil attached to the silicone superstructure can delaminate, resulting in two components. At temperatures above 41C the adhesive becomes very tacky, and there is a risk of filaments being created during the removal of the superstructure. These filaments might contaminate the arrays and adversely affect the subsequent image analysis.
