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Is there an alternative to Tin/Lead Hot Air Leveled Solder?

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Is there an alternative to Tin/Lead Hot Air Leveled Solder?

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Yes. Alternatives available from eFabPCB are Immersion Tin(a.k.a. White Tin), OSP, Electroless Nickel Immersion Gold (ENIG or Au Flash), Immersion silver and Lead Free Hot Air Leveled Solder. More information on the pros and cons of each of these processes is available.

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