Is there a preferred bond pad size?
Certainly the larger the bond pad size the easier it is. The bond pad size needs to increase as wafer size increases to make up for mismatches in thermal expansion characteristics between a probe card and wafer which is dependent on total thermal test range. Due to Ceramic construction, Celadon Probe Cards have a very close match between wafer expansion and probe card expansion enabling users to just have one probe card to cover a whole temperature range. There is a relationship between maximum distances from pad to pad due wafer size, temperature range and pad size. Celadon application engineering can review this with you.
