If a device is converted to Pb-Free, will TI continue to supply the Pb-based part?
TI divides up parts into those that are completely compatible with both Pb and lead-free based solders and soldering temperatures and those that are not compatible. Most TI leadframe based packages utilize Nickel-Palladium-Gold (NiPdAu) finishes. This finish is not solder dipped, and thus is fully compatible with current Pb-based solders and reflow temperatures, and newer lead-free solders with their higher reflow temperatures. TI has been supplying these parts for over 10 years and has shipped billions of parts with this finish. Although compatible with RoHS thresholds for over a decade, many of these products had not been certified for high temperature reflow (250C-260C). TI is converting the remainder of its leadframe based packages to NiPdAu and qualifying all of them for high temp reflow. Once converted/qualified, TI plans to offer only one version of these products, which is qualified for both Pb-free and lPb-based solders. A limited number of products may initially only be avail
