How will a StencilQuik™ stencil be affected by placement on a warped area of the board?
StencilQuik™ stencils will not be affected at all by a warped area of the board. Since the StencilQuik™ stencil is flexible, it will conform to all areas of the board. This will ensure that the paste print will be uniform and consistent every time. Please be aware that even when using a StencilQuik™ stencil, if the board is extremely warped some of the balls of the BGA may not make contact with the paste.
Related Questions
- If the solder mask is damaged or missing in the area of the board where the StencilQuik™ stencil will be applied, do I have to repair the mask underneath the part?
- Has NS performed environmental studies within the area proposed for placement of the BRIMF?
- Is placement an issue beyond putting it in an area of strong current?
