How thick is the metallization layer?
Coatings are generally applied in the form of liquid inks. The liquid contains metal particles and binders. The wet metallization layer ranges according to application. Typical values are roughly 300-1500u or .0003-.0015. After firing in a controlled atmosphere furnace, a diffusion layer is formed and the actual metal layer becomes somewhat thinner than the original wet layer. Subsequent to a metallizing step and thermal set, additional metals such as nickel, copper, silver and/or gold are typically deposited. Nickel is by far the most common selection. Nickel thicknesses range according to application 50-300u in general. The subsequent coatings are optional (help protect the MoMn metallization layer) but are frequently included because they help aid solder/braze wetting.
