How many molds will be required to support high volume production?
For each bump footprint, molds are reusable for hundreds of solder transfers, thus requiring only a limited number. Depending on wafer volumes for each footprint, mold quantities may vary from a minimum of 2-3 for small trial lots to several dozen for hundreds/thousands of wafers. A sophisticated mold-model is available to determine the appropriate amount of molds for a specific wafer volume requirement.