How is solder reflow simulation performed?
Since semiconductor packages are solder connected to a motherboard, packages must be able to withstand the high temperatures at which solders melt. For JEDEC MSL reliability testing, typically 3 reflow cycles are performed within 4 hours after preconditioning is completed. Reflow profiles (peak temperature, ramp rate, and time) are package size and solder type dependent. In addition, target temperature ranges vary for each reflow system as set by JEDEC. Typical peak temperatures include 220°C, 235°C, 240°C, 245°C, and 260°C. Analysis and testing is then done to check for failures such as delamination, cracking, and electrical failures.
