How is heat dissipation handled with the Ultra CSPTM?
The Ultra CSPTM has excellent heat dissipation. The usage of large solder balls mounted directly to an FR4 board results in significant levels of heat being conducted from the die to the board. Unlike other CSPs that utilize a compliant layer between the die and the solder ball, the direct connection of the Ultra CSPTM solder ball to the UBM enhances this heat transfer. Additionally, the exposed backside of the die expels heat to the surrounding air.
