How is die tilt controlled during die bonding?
Differences in die height and/or bond line thickness (die tilt) can be caused by uneven substrate surface, oversized particles in the bondline, and bond parameters, such as nonplanarity of the bond head to dispense platform and poor dispense pattern. All these factors can lead to poor coverage of adhesive under the die, total package thickness problems, broken die, poor wire bondability and optical misalignment.
