How is chip warpage affected by bond line thickness?
Chip warpage is proportional to the CTE mismatch between die and substrate, die size, modulus of the adhesive, and cure temperature, in addition to, bond line thickness. In general, although thinner bond lines result in higher conductivity, there is also an associated higher package stress/warpage and possibly lower die shear strength. However, the use of thicker bondlines for relatively small die may cause die floating (unwanted die movement after die placement).
