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How is bump height uniformity depending on actual bump size and ball pitch?

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How is bump height uniformity depending on actual bump size and ball pitch?

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With C4NP, bump height uniformity does not depend on ball pitch. Bump height uniformity is directly related to solder volume control. Solder volume is controlled via the mold. C4NP bump height uniformity is well below JEDEC specifications and is improved over alternative bumping technologies.

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