How has NEXX made thin, uniform boundary layer deposition cost effective?
The critical success factor for reliable thin boundary layer deposition equipment is a completely leak-free sealed contact to the wafer edge. Our patented integrated contact/seal and fail-safe wafer holder provide a compliant seal and continuous electrical contact around the wafer perimeter. This design enables paddle agitation just 1.5 mm from the wafer surface, facilitating superior fluid mixing. These innovations are the foundation of a process cell with the process advantages of thin boundary layer deposition in a configuration that is reliable and cost-effective.
