How does the RoHS directive affect my printed circuit boards?
A. For many years the electronic industries have used tin/lead solder to join the components to the printed circuit boards. The board fabricators have also used tin/lead solders as a surface finish to protect the copper from corrosion. The 63/37 tin lead ratio of solder fit well within the assembly thermal parameters and the physical limitations of the base materials. The standard FR-4 laminates were also compatible with the wave solder systems. RoHS requirements have changed the rules. No longer are the tin lead solders allowed!