How does the cost of Thermal Clad compare to that of DBC?
Again the costs have to be like for like. Unlike Thermal Clad, Direct Bonded Copper (DBC) always involves some method of mechanically attaching it to a heat sink. This is either a solder operation or a mechanical frame to secure the DBC. It is not possible to secure the DBC with mounting holes built into the delicate ceramic whereas Thermal Clad can support mounting holes, rivets, press-in fastners, etc. In simple terms, Thermal Clad can be worked like any metal sheet, even forming into a box-shape is possible. Taking into consideration all relevant costs, Thermal Clad system provides lower overall costs when comparing it to a DBC substrate and heat sink assembly.
