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How do I properly prepare a BGA component for reballing?

April 26, 2017BGA component prepare properly reballing

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How do I properly prepare a BGA component for reballing?

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First, clean and bake packages. Next, remove the solder using a variety of processes and equipment, including hot air vacuum tools, desoldering braid and soldering iron, and wave solder. These methods take only a few seconds per component. After removal of residual solder, clean away flux residues with an isopropyl alcohol wipe. Our BGA Reballing Starter Kit contains a complete detailed instruction manual for deballing components.