How do I avoid gate oxide damage from process-induced charging (antenna effects)?
See the Antenna Rules 9.0 What precautions are necessary to protect MOSIS parts from damage caused by electrostatic discharge (ESD)? MOSIS handles wafers and singulated and packaged parts in a static-controlled environment with regulated humidity and conductive or dissipative flooring, work surfaces, carriers, and tools. Personnel wear conductive outer garments and gloves and a conductive wrist strap when handling any semiconductor product material. Parts are shipped in static-dissipative, protective packaging. Designers and end users must enforce appropriate protective measures against static discharge damage. ESD pads should be employed whenever possible, and parts should be handled only by trained operators in a static-controlled environment. 10.0 In the PDF file for the design rules, a suggested pad structure was shown. This pad structure used all metal layers. It is possible to make pads with only one or two metal layer? Or will this pose a problem? Pads (with each metal layer) ar
