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How can I develop a good lead-free hand-soldering process, which will ease the operation?

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How can I develop a good lead-free hand-soldering process, which will ease the operation?

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In a recent study, which appeared in the Lead-free Update by TechSearch International in December 2004, hand-soldering was found to be more problematic to implement when compared to lead-free wave soldering and SMT. The reason could be that hand-soldering is more operator dependant than reflow and wave soldering but also the surface tension in lead-free solders is slightly higher. Wetting or spread is also a little slower when compared to 63/37. To reduce operator issues and reduced wetting proper optimization of the soldering process is key. To avoid issues use a flux content of 2-3% by weight in the solder wire, use a solder tip temperature of 700-800º F. Also Tin-Silver-Copper (SAC) solder will flow more readily than Tin-Copper (SnCu) solder. The main issues encountered with lead-free hand-soldering are cold solder joints, poor wetting and de-wetting. These can be avoided.

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