How can I convert an SCMOS design from SCN4M_SUBM (TSMC 0.35 micron) to SCN5M_SUBM (TSMC 0.25 micron)?
For single-poly TSMC 0.35 micron designs, lambda must be redefined from 0.2 (for TSMC 0.35) to 0.15 (for TSMC 0.25). Pads should not be directly scaled, so the pad ring may need special attention. This includes adding via4 and metal5 to the TSMC 0.25 pad stacks. Note that TSMC 0.25 might permit smaller lambda values for Rule 22 (metal4) than the original TSMC 0.35 design. TSMC 0.35 Poly2-Poly1 capacitors should be converted to TSMC_025 M4_Prime-M4 capacitors. 7.0 What are the requirements for metal fill for CMP (chemical mechanical polishing), and how do I incorporate these features into my design? See MOSIS CMP and Antenna Rules. 7.1 What if my design doesn’t meet the CMP requirements? Will MOSIS fill it? If a design contains layers which do not meet density requirements for chemical mechanical polishing (CMP), then other designs on the reticle must make up for the deficit, or there must be enough blank area between designs to permit MOSIS to add sufficient fill. If layer density requ
