How can filled molds be repaired if there are fill-defects?
The repair process is a manual step carried out on a manual workstation equipped with a low power microscope. Optionally, a repair setup can be implemented on the Mold Inspect Tool if required. The goal is to tune the process such that the number of mold defects is low enough so that mold repair is not required. However, the ability to repair molds prior to solder transfer is a key benefit of the C4NP bumping process. The solder is not transferred on the wafer until required defect thresholds are met.
