How can 750FX and 750GX thermal runaway be avoided?
As described in the Datasheets, both the 750FX and 750GX parts demonstrate a positive temperature coefficient of power dissipation. This is a common characteristic of most high-integration CMOS parts, and is caused by the increase in leakage current with an increase in junction temperature. The classic technique to avoid thermal runaway works well with these processors; the system must supply more cooling than is required for the maximum power dissipation of the part. For more information, see the Applications section of the Datasheet, and the Application Note and Customer Presentation on 750FX and 750GX Power Dissipation.
