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How are the devices physically changing?

April 26, 2017changing Devices physically

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How are the devices physically changing?

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The traditional material used for soldering and for lead (pin) finishing on devices is SnPb. The most widely accepted alloy used for lead-free soldering is SnAgCu. Most suppliers will be using pure Tin (matte Sn) as their lead finishing of lead frame packages and SnAgCu for the solder sphere of array packages (BGA). There are several other options that various suppliers may be using for lead (pin) finishing, such as: Tin Bismuth (SnBi), Nickel Palladium Gold (NiPdAu), Tin Silver Copper (SnAgCu), Tin Copper (SnCu), Tin Zinc (SnZn), and others.