How are air bubbles avoided in the final molded part?
Ensuring that the mold-set is vented correctly and optimizing the injection profile is the key to avoiding air bubbles. Densely populated circuit boards may require several steps in the injection profile to avoid any “shadow effects” behind components. Cavist will typically start by optimizing molding parameters with translucent materials to detect if voids occur, and then change to black materials for production.
