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Have packages been improved to withstand the higher reflow temperatures required for assembly?

April 26, 2017assembly Packages reflow temperatures withstand

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Have packages been improved to withstand the higher reflow temperatures required for assembly?

1 Answer

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10 Posted

Yes. All Pb-free package construction materials such as die attach, substrate, mold compound etc. have been significantly improved to extend their capability to withstand higher reflow temperature requirements during assembly.