Has Testing Been Done to Qualify Diodes Incorporateds Lead Free Finishes for Use in Standard SMT/Through-Hole Assembly Processes?
Each product family where the Lead Finish is being converted to Pb Free has been or will be re-qualified by subjecting a family sample to the following tests (typical): Preconditioning (PC) followed by: • Highly Accelerated Stress Testing (HAST) • Autoclave (AC) • Temperature Cycling (TC) • Solderability • With SnCuAg Solder • With SnPb Solder • Resistance to Solder Heat (RSH)