Does the RDA012M4/MS need a heatsink?
The RDA012M4 dissipates the heat through the metal pad at the bottom of the package, which is also electrically connected to the device GND. The suggested way to dissipate the heat is to use the PCB’s ground plane as a heatsink. The PCB should have a metal pad where the RDA012M4 body will sit. This pad is connected to the ground plane through metal vias that also conduct the heat. If you feel that a heatsink is needed, it should be mounted on the opposite side of the PCB, directly bellow where the MUXDAC will be located. It will attach to a metal pad, soldered if possible, that will be connected to the metal pad where the MUXDAC is seated through metal vias. Since the back of the package is used as ground connection, the heatsink will be grounded. Care should be taken to avoid contact between the heatsink and other circuitry that might be close to it. Via configuration for MUXDAC ground connection / heat dissipation: 10 mil diameter vias spaced 50 mils apart, evenly distributed in an a
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