Does the heated spray gun have benefits in addition to reduced solvent usage?
Heated spray gun technology has improved the ability of HVLP systems to encapsulate traces, because the LPISM returns to room temperature and higher viscosity before it strikes the PCB. The heated gun also reduces LPISM usage by allowing thinner coatings to adequately cover higher circuit traces. Because the heated gun requires less solvent in the LPISM, tack-dry times are significantly reduced; if the 9724IR Tackdry Oven is used in conjunction with the 9524 Spray Unit, tack dry time may be reduced to as little as 3 minutes.
