Does the elimination of lead (Pb) require any other changes for board-level assembly?
Yes. Lead-free solders used in the board-level assembly processes require a higher temperature to complete a reliable solder joint. Customers may also require tighter temperature controls in their assembly process. Higher processing temperatures may entail additional dry packing and a shorter time that components are allowed outside of dry pack. Products intended for lead-free board assembly should meet the following criteria: • The solder joints connecting semiconductor components to a board must reach a minimum solder joint temperature to ensure a reliable solder joint. This minimum temperature is higher for lead-free solders than for existing tin-lead (SnPb) solders. • The package peak temperature (PPT) is higher than the solder joint temperatures for surface mount devices during soldering processes. Components are qualified for maximum PPT ranging from 245°C to 260°C compared to historical range of 220°C to 245°C. • The semiconductor components are certified to be robust enough to
Related Questions
- What if I have a requirement for a RoHS Compliant or RoHS Compliant (Pb-free) component or assembly that is only offered by Ecliptek with Lead (Pb)?
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- HOW MUCH LEAD TIME DOES STUDS & BUGS REQUIRE TO MAKE AN APPOINTMENT FOR AN INSPECTION?
