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Does the bond accommodate thermal stresses during use like indium does?

April 26, 2017ACCOMMODATE Bond indium stresses Thermal

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Does the bond accommodate thermal stresses during use like indium does?

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A. In general, the solder used is more rigid than indium and does not relax or flex as much as indium. However, because the target has been bonded at room temperature, the target does not start with high residual stresses making it less likely to crack or debond prematurely.