Does Samtec have information on Paste In Hole (PIH) Processing?
The fundamental theory behind PIH is that a printed volume of solder paste on a PWB, and over the plated through hole, will reflow into the hole and around the contact or terminal lead while being processed through an IR oven set at typical surface mount parameters. The key to success is printing a sufficient solder volume to fill the hole and, hopefully, obtain robust fillets. However, space limitations and stencil thickness may prevent the possibility of the latter. Per IPC-A-610C, a minimum of 75% of the hole must be filled to produce an acceptable class 1, 2 or 3 joint. As with most things, convenience comes at a cost. If a lack of solder fillets is something you may be willing to sacrifice, while maintaining IPC adherence, paste in hole processing may be a viable alternative to multiple processing runs. For more information on PIH Processing, contact our Interconnect Processing Group.
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- Does Samtec have information on Paste In Hole (PIH) Processing?
