Important Notice: Our web hosting provider recently started charging us for additional visits, which was unexpected. In response, we're seeking donations. Depending on the situation, we may explore different monetization options for our Community and Expert Contributors. It's crucial to provide more returns for their expertise and offer more Expert Validated Answers or AI Validated Answers. Learn more about our hosting issue here.

Could C4NP be used to generate high-lead bumps? What kind of high-lead solder bump reliability can be achieved with C4NP?

April 26, 2017achieved bump bumps c4np reliability solder Used

0

Posted

Could C4NP be used to generate high-lead bumps? What kind of high-lead solder bump reliability can be achieved with C4NP?

1 Answer

0

Posted

Yes. New materials which can withstand the higher temperatures needed to process high-lead solder are planned to be qualified. Reliability is a function of high-lead composition and UBM/BLM materials used. It is not influenced by the C4NP technology to manufacture the bumps.