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Can the Ultra CSPTM meet industry standard footprints?

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Can the Ultra CSPTM meet industry standard footprints?

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Yes, we can meet any footprint, standard or non-standard, that can be patterned in a fan-in approach. The usage of lithography tools for defining solder ball locations results in extremely accurate/consistent ball patterning. Our minimum pitch is currently 0.50mm, however a 0.40mm pitch process will be developed/qualified in 1999.

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