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Can several pieces of the material be bonded together with minimal thermal resistance?

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Can several pieces of the material be bonded together with minimal thermal resistance?

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Yes joining samples is best done by our team with specialized silver brazing techniques to assure minimal thermal resistance at the bond juncture. High thermal conductivity pastes or adhesives may be used, but will not offer optimal performance. DiaCu is offered with a layer of copper, which can be soldered or brazed to a heat sink.

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